The demand for flagship-tier chipsets without paying the full price for a Snapdragon 888 is massive, and Qualcomm reportedly is working on a new platform that will borrow the connectivity modules, without going overboard with the CPU.

The chip will be called Snapdragon 780G and will bring in the FastConnect 6900 integrated mobile connectivity system for ultra-fast Wi-Fi 6e speeds and Bluetooth 5.2. According to the leakster, the chip will also have a new Snapdragon X53 5G modem with max DL speeds of 3.3 Gbps.

There is no word about the CPU or the GPU of this platform. Some of the…

Source: Mobile Phones – GSMArena

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